Development of 300 GHz band phased array transmission module for 6G NTT and Tokyo Institute of Technology|電経新聞

Development of 300 GHz band phased array transmission module for 6G NTT and Tokyo Institute of Technology

300GHz帯フェーズドアレイ送信機の3次元分解図およびチップ(3D exploded view and chip photo of 300GHz band phased array transmitter)

NTT and Tokyo Institute of Technology have developed a 300 GHz band phased array transmission module for 6G in the 2030s, and have succeeded in high-speed wireless data transmission in the 300 GHz band using beamforming for the first time in the world.
This technology makes it possible to instantly transmit extremely large amounts of data to moving receiving terminals.
Tokyo Institute of Technology produced a highly integrated CMOS-IC equipped with a frequency conversion circuit and control circuit. NTT has developed an InP-IC that integrates a high-output power amplifier circuit and an antenna by utilizing its own Indium Phosphorus Heterojunction Bipolar Transistor (InP HBT) technology. Furthermore, a 4-element phased array transmission module is realized by compactly mounting the CMOS-IC and the InP-IC on the same printed circuit board. This transmission module achieves a maximum data rate of 30 Gbit/s over a directivity control range of 36 degrees and a communication distance of 50 centimeters, making it the world’s first successful high-speed wireless data transmission using beamforming in the 300 GHz band. .