OKI IDS has launched a “thermal analysis simulation service for space equipment” for equipment mounted on rockets and artificial satellites that operate in special environments that require cooling methods different from those on the ground.
Targeting the space market, the company will contribute to the sophistication of heat dissipation design for equipment housings and shorter delivery times by utilizing its unique heat conduction simulation technology.
Thermal analysis simulation calculates changes in the temperature distribution and thermal stress of equipment due to heat transfer. Since the environment in which the equipment is placed can be freely set, it is possible to calculate temperatures in places that cannot be measured on the actual equipment. This allows the design to be verified before manufacturing, shortening development time and reducing manufacturing costs.
On the other hand, simulation in the space environment has several challenges. One of them is the sudden change in the operating environment when moving from the ground to the vacuum environment of space. In addition, since there is no air in space, convection heat transfer by air cooling technology is not possible, and the main method of heat dissipation is heat conduction from the heat source, the electronic components, to the housing via the printed circuit board (PCB). These factors made it difficult to accurately predict heat conduction between objects.
The new service will perform unsteady thermal analysis to accurately grasp changes in temperature distribution in environments that change rapidly over time. This will enable simulations that reproduce in detail temperature fluctuations under actual operating conditions.
OKI IDS is aiming for sales of 50 million yen in fiscal year 2026.

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