Resonac will establish a consortium called “US-JOINT” in Silicon Valley, USA, consisting of 10 Japanese and American companies involved in materials and equipment in the field of next-generation semiconductor packaging. The plan is to expand the efforts of the “JOINT” and “JOINT2” consortiums for semiconductor packaging technology development, which have been carried out in Japan beyond the boundaries of semiconductor manufacturing equipment and material manufacturers, overseas with the participation of American companies.
The activity base will be established in Silicon Valley, and preparations will begin for clean rooms and equipment installation, with the goal of starting operations next year.
In next-generation semiconductors for AI and autonomous driving, post-process packaging technology is one of the keys, and new concepts are being created one after another.

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